| 发明名称 |
Method of manufacturing passive component module |
| 摘要 |
A method of manufacturing a passive component module includes the steps of: bonding passive components to a carrier, wherein each of the passive components has interconnection pads; forming a dielectric molding material over the carrier, so that the passive components are embedded in the molding material; separating the molding material, which has the passive components embedded therein, from the carrier; exposing all interconnection pads of the passive components; and building electrical interconnections between the passive components to obtain the passive component module. The steps of bonding, forming, separating, exposing and building are performed in the recited order. |
| 申请公布号 |
US9125320(B2) |
申请公布日期 |
2015.09.01 |
| 申请号 |
US201113298205 |
申请日期 |
2011.11.16 |
| 申请人 |
|
发明人 |
Hu Dyi-Chung |
| 分类号 |
H05K3/30;H05K3/36;H05K3/20;B23P19/00;H05K1/18;H05K3/00;H05K3/28 |
主分类号 |
H05K3/30 |
| 代理机构 |
Lowe Hauptman & Ham, LLP |
代理人 |
Lowe Hauptman & Ham, LLP |
| 主权项 |
1. A method of manufacturing a passive component module, the method comprising the steps of:
bonding passive components to a carrier, wherein each of the passive components has interconnection pads; forming a dielectric molding material over the carrier, so that the passive components are embedded in the molding material; separating the molding material, which has the passive components embedded therein, from the carrier; exposing all interconnection pads of the passive components; and building electrical interconnections between the passive components to obtain the passive component module, wherein the steps of bonding, forming, separating, exposing and building are performed in the recited order. |
| 地址 |
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