| 摘要 |
<p>The present invention provides a lithography apparatus which performs a process to form a pattern on a substrate returned from a coating device to coat the substrate with a resist. The lithography apparatus comprises: an acquisition unit to acquire first specifying information specifying a target substrate returned to the lithography apparatus from the coating device among a plurality of substrates which are coated by the coating device and on which the process is to be performed from the coating device; and a processing unit to select a set of offset correction information corresponding to the target substrate from a plurality of sets of offset correction information corresponding to the substrates based on the first specifying information, and use the selected set of offset correction information to perform the process on the target substrate.</p> |
