摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat dissipation structure capable of preventing the position change of a positioned imaging device, irrespective of tilt adjustment. <P>SOLUTION: There is provided a heat dissipation structure 60 of an imaging device 11 retained by a tilt adjustment mechanism 50 capable of changing an inclination to a housing so as to make an imaging plane 11a of the imaging device 11 for acquiring a subject image, formed by an imaging optical system (40), coincident with a reference plane Bp, relative to the imaging optical system, preset in the housing (39). The heat dissipation structure 60 includes a heat conductive member 61, composed of a material having thermal conductivity, including one end 62 fixed to the imaging device 11, another end 66 fixed to the housing and a long plate 64, having a long plate shape, for connecting the other end 66 to the one end 62. On the heat conductive member 61, a first boundary 63 forming a boundary between the one end 62 and the long plate 64 is set along a direction orthogonal to a second boundary 65 forming a boundary between the other end 66 and the long plate 64. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |