发明名称 電解銅箔及びその製造方法
摘要 <p>An electrolytic copper foil (1) characterized by comprising copper crystal grains (3) and, present inside the copper crystal grains (3) or at the boundaries thereamong, inclusions (5) having an average diameter of 0.5-100 nm, wherein the inclusions comprise an inorganic compound and/or an organic compound, the inorganic compound comprising an oxide of at least one metallic element selected from the group consisting of tungsten, molybdenum, titanium, and tellurium and the organic compound comprising at least one thiourea-based organic compound selected from the group consisting of thiourea, ethylenethiourea, tetramethylthiourea, and 1,3-dimethyl-2-thiourea.</p>
申请公布号 JP5740052(B2) 申请公布日期 2015.06.24
申请号 JP20140523525 申请日期 2014.01.10
申请人 发明人
分类号 C25D1/04;C25D1/00;H01M4/66 主分类号 C25D1/04
代理机构 代理人
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