| 发明名称 | Light emitting diode package | ||
| 摘要 | A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame. | ||
| 申请公布号 | US9059386(B2) | 申请公布日期 | 2015.06.16 |
| 申请号 | US201414330518 | 申请日期 | 2014.07.14 |
| 申请人 | Seoul Semiconductor Co., Ltd. | 发明人 | Kim Bang Hyun |
| 分类号 | H01L33/00;H01L33/62;H01L33/64;H01L25/16;H01L33/48 | 主分类号 | H01L33/00 |
| 代理机构 | H.C. Park & Associates, PLC | 代理人 | H.C. Park & Associates, PLC |
| 主权项 | 1. A light emitting diode (LED) package, comprising: an LED chip; a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space; and a housing disposed on the first lead frame and the second lead frame, the housing comprising: an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame; andan internal housing disposed in the space, the internal housing covering a first top portion of the first lead frame and a first top portion of the second lead frame, and the internal housing exposing at least a second top portion of at least one of the first lead frame and the second lead frame. | ||
| 地址 | Ansan-si KR | ||