METHOD FOR MANUFACTURING DEVICE, AND METHOD FOR MANUFACTURING EL MODULE

摘要

PROBLEM TO BE SOLVED: To suppress discharge due to static electricity generated by peeling when an element formation layer including a semiconductor element is peeled from a substrate used in manufacturing of the semiconductor element.SOLUTION: A release layer 12 and an element formation layer 11 are formed on a substrate 10. Support base material 13 which can be peeled later is fixed to an upper surface of the element formation layer 11. The element formation layer 11 is transformed via the support base material 13 to generate peeling at an interface between the element formation layer 11 and the release layer 12. The peeling is performed while supplying liquid 15 so that the element formation layer 11 and the release layer 12 which appear sequentially due to the peeling, are wetted with the liquid 15 such as pure water. The liquid 15 disperses electric charges generated on surfaces of the element formation layer 11 and the release layer 12, and thus, discharge due to peeling electrification is eliminated.