WAFER CUTTING SACRIFICIAL SUBSTRATE FOR USE IN WAFER CUTTING

摘要

The invention relates to a sacrificial substrate (1) having a mounting surface (2) for holding a piece of material (3) such as an ingot brick or core for cutting a plurality of wafers from the piece of material (3) wherein the sacrificial substrate (1) has an E modulus smaller than 6000 MPa more preferably smaller than 5000 MPa most preferably smaller than 4000 MPa. The invention also relates to a method of making a plurality of wafers of a piece of material (3) such as an ingot brick or core comprising the steps of: mounting the piece of material (3) to a sacrificial substrate (1) preferably by gluing; mounting the sacrificial substrate (1) with the piece of material (3) in a cutting device; and cutting the piece of material (3) into a plurality of wafers.