| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method of a through electrode substrate which inhibits the occurence of voids in a conductive part.SOLUTION: In a through electrode substrate manufacturing method according to one embodiment, a through hole penetrating through front and rear surfaces of a substrate is formed, and a mask is disposed on at least the one side of the through hole. A seed layer is formed on the substrate through the mask, and the through hole is filled with a conductive material by an electrolytic plating method which supplies electric power to the seed layer to form a conductive part.</p> |
