发明名称 |
COPPER ALLOY |
摘要 |
A copper alloy according to the present invention comprises 17 to 34 mass% of Zn, 0.02 to 2.0 mass% of Sn, 1.5 to 5 mass% of Ni and a remainder made up by Cu and unavoidable impurities, wherein the relationships represented by the formulae mentioned below are satisfied: 12 = f1 = [Zn]+5×[Sn]-2×[Ni] = 30, 10 = [Zn]-0.3×[Sn]-2×[Ni] = 28, 10 = f3 = {f1×(32-f1)×[Ni]}1/2 = 33, 1.2 = 0.7×[Ni]+[Sn] = 4 and 1.4 = [Ni]/[Sn] = 90. The copper alloy has an electric conductivity of 13 to 25% IACS or less, and the occupation ratio of an a phase is 99.5% by area or more or the area ratio (?) (%) of a ? phase and the area ratio (ß) (%) of a ß phase in the a phase matrix have a relationship represented by the formula: 0 = 2×(?)+(ß) = 0.7. |
申请公布号 |
CA2923462(A1) |
申请公布日期 |
2015.04.02 |
申请号 |
CA20142923462 |
申请日期 |
2014.09.26 |
申请人 |
MITSUBISHI SHINDOH CO., LTD. |
发明人 |
OISHI, KEIICHIRO;NAKASATO, YOSUKE;HATA, KATSUHIKO;TANAKA, SHINJI |
分类号 |
C22C9/04;C22F1/00;C22F1/08 |
主分类号 |
C22C9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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