发明名称 METAL-RESIN JOINT STRUCTURE AND METHOD OF PRODUCING THE SAME, AND CIRCUIT BOARD AND COPPER CLAD LAMINATE HAVING THE METAL-RESIN JOINT STRUCTURE
摘要 <p>PROBLEM TO BE SOLVED: To provide a metal-resin joint structure.SOLUTION: A metal-resin joint structure of the invention embodiment comprises a resin layer, a metal layer joined to the resin layer, and a modified layer provided in a joint area of the resin layer and the metal layer and comprising a silane coupling agent for providing the joint force between the resin layer and the metal layer.</p>
申请公布号 JP2015006783(A) 申请公布日期 2015.01.15
申请号 JP20130231145 申请日期 2013.11.07
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 YONG HYOJIN;JEONG JI YUN;HAM SUK JIN;CHO HYE JIN
分类号 B32B15/08;B32B15/088;C07F7/18;C09J11/06;C09J183/04;H05K3/38 主分类号 B32B15/08
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