发明名称 |
METAL-RESIN JOINT STRUCTURE AND METHOD OF PRODUCING THE SAME, AND CIRCUIT BOARD AND COPPER CLAD LAMINATE HAVING THE METAL-RESIN JOINT STRUCTURE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a metal-resin joint structure.SOLUTION: A metal-resin joint structure of the invention embodiment comprises a resin layer, a metal layer joined to the resin layer, and a modified layer provided in a joint area of the resin layer and the metal layer and comprising a silane coupling agent for providing the joint force between the resin layer and the metal layer.</p> |
申请公布号 |
JP2015006783(A) |
申请公布日期 |
2015.01.15 |
申请号 |
JP20130231145 |
申请日期 |
2013.11.07 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
YONG HYOJIN;JEONG JI YUN;HAM SUK JIN;CHO HYE JIN |
分类号 |
B32B15/08;B32B15/088;C07F7/18;C09J11/06;C09J183/04;H05K3/38 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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