LEAD FRAME FOR LED AND LED PACKAGE USING THE SAME,申请号JP20130112272-传众专利搜索

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发明名称	LEAD FRAME FOR LED AND LED PACKAGE USING THE SAME
摘要	PROBLEM TO BE SOLVED: To provide a lead frame for an LED in which only small stress occurs on an interface joined to the LED and peeling of the LED is inhibited when the lead frame is joined to the LED, and to provide an LED package using the lead frame.SOLUTION: A lead frame for an LED is formed by a metal body and includes a lead part. The lead frame for the LED has a protruding surface which is relatively protruded by a part of the lead part being formed so as to be thinner than the other portion of the lead part. The protruding surface serves as a mounting surface of the LED.
申请公布号	JP2014232781(A)	申请公布日期	2014.12.11
申请号	JP20130112272	申请日期	2013.05.28
申请人	HITACHI METALS LTD	发明人	AKIMOTO KATSUYA
分类号	H01L33/62;H01L23/48	主分类号	H01L33/62
代理机构		代理人
主权项
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