发明名称 SUBSTRATE PLATING DEVICE
摘要 <p>The present invention relates to a substrate plating device having a non-contact type gear transfer structure, and more specifically, to a substrate plating device formed of a water tank having plating liquid filled; and a transfer unit inserting a substrate into the water tank to transfer the substrate, wherein the transfer unit includes a main housing body disposed at a side surface of the water tank, and having a rail panel provided on an upper surface; a driving unit formed of a driving shaft to which a driving gear, installed at the main housing body to be rotated, is installed, and a driving motor rotating the driving shaft; a working unit formed of a working shaft installed at the main housing body to be rotated, having a rotary gear provided to be rotated by receiving rotary power of the driving gear, and having a transfer gear formed at one end, and a bearing unit having the working shaft supported to be rotated; and a transfer unit having a roller provided to be moved along the rail panel, having a rack geared to the transfer gear, having a holder to which a substrate is fixed formed at one end, such that the driving gear and the rotary gear are formed in a magnet gear structure to enable rotary force to be transferred by magnetic force with a non-contact method, thereby reducing noise generated during a power transfer process, and saving maintenance and repair costs due to not having friction.</p>
申请公布号 KR101472003(B1) 申请公布日期 2014.12.10
申请号 KR20140087420 申请日期 2014.07.11
申请人 NEOPMC CO., LTD.;BAE, MIN SU 发明人 BAE, MIN SU
分类号 C25D17/02;C23C2/40;C25D17/06 主分类号 C25D17/02
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