| 摘要 |
<p>THE PRESENT INVENTION RELATES GENERALLY TO A METHODOLOGY OF FORMING OPTICAL LENS (103) ON SUPPORT STRUCTURE (101) FOR SEMICONDUCTOR LIGHT EMITTING DEVICE (100) BY APPLYING LOW SURFACE ENERGY BARRIER BAND OR SURFACE (104) ONTO SAID SUPPORT STRUCTURE (101). SAID OPTICAL LENS (103) IS USED AS AN ENCAPSULATION OVER SEMICONDUCTOR LIGHT EMITTING DIE (102) TO SHAPE AND EXTRACT LIGHT OUT FROM THE SEMICONDUCTOR LIGHT EMITTING DIE (102), AS WELL AS TO PROVIDE PROTECTION FROM MECHANICAL DAMAGE AND ENVIRONMENTAL INFLUENCE. (THE MOST ILLUSTRATIVE</p> |
