发明名称 |
SUBSTRATE FOR SUSPENSION, SUSPENSION, SUSPENSION WITH ELEMENT, HARD DISK DRIVE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR SUSPENSION |
摘要 |
PROBLEM TO BE SOLVED: To prevent an occurrence of short circuit caused by solder between terminal parts when a solder bump is formed on a terminal part provided in a substrate for suspension.SOLUTION: The substrate for suspension includes: a metal support substrate; an insulation layer formed on the metal support substrate; and a wiring layer formed on the insulation layer. The wiring layer includes a terminal part to be connected to an external circuit board, and the terminal part includes a terminal opening part. In the plan view, the insulation layer has an insulation layer opening part at a position superposed with at least a part of the terminal opening part, and a wettability improving plating layer is formed on the surface of the metal support substrate that is exposed from the insulation layer opening part. |
申请公布号 |
JP2014175027(A) |
申请公布日期 |
2014.09.22 |
申请号 |
JP20130045870 |
申请日期 |
2013.03.07 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
ONUKI MASAO;OCHI KAZUNORI;MATSUYAMA KENTARO |
分类号 |
G11B5/60;H05K1/05;H05K3/24 |
主分类号 |
G11B5/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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