| 摘要 |
PROBLEM TO BE SOLVED: To cool electronic components such as LSI chips stably by limiting production of bubbles in thermal grease. SOLUTION: An cooling structure of an electronic component comprises: an electronic component 10 mounted on the surface of a wiring board 30; a heat sink 20 provided to cover the electronic component 10; and a thermal grease 40 having semi-fluidity and filling the gap between the electronic component 10 and the heat sink 20. The heat sink 20 has a peripheral wall 25 projecting from the surface on the electronic component 10 side and housing the electronic component 10 in the inside space. The peripheral wall 25 has open parts 22 formed at positions corresponding to corners of the electronic component 10 and interconnecting the inside space and the outside. The thermal grease 40 fills the inside space and is stored in the open parts 22. COPYRIGHT: (C)2012,JPO&INPIT |
