| 摘要 |
PROBLEM TO BE SOLVED: To reliably establish thermal coupling between communication modules and a cooling mechanism provided on a substrate on which the communication modules are mounted.SOLUTION: A signal transmission device 1 comprising communication modules 10 mounted on a motherboard 2 having a heat sinks 4 includes; a pressing member 20 which is provided on the motherboard 2 and is switchable between a first state and a second state in which the pressing member 20 is positioned closer to the heat sink 4 compared to the first state; and female connectors 17 which are arranged along the heat sink 4 and are for connecting the communication modules 10. When the pressing member 20 is switched to the second state, the communication modules 10 connected to the female connectors 17 are pressed against the heat sink 4 by the pressing member 20. |
