| 发明名称 |
UNDERFILL SHEET, UNDERFILL SHEET INTEGRATED WITH TAPE FOR GRINDING REAR SURFACE, UNDERFILL SHEET INTEGRATED WITH DICING TAPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
Provided is an underfill sheet capable of favorably filling an unevenly profiled circuit surface of a semiconductor element, favorably connecting the terminal of the semiconductor element with the terminal of an object onto which the semiconductor element is mounted, and reducing outgas. The present invention relates to an underfill sheet which has a viscosity of 1000 - 10000 Pa∙s at 150°C and 0.05 - 0.20 rpm, and has a minimum viscosity equal to or higher than 100 Pa∙s at 100 - 200°C and 0.3 - 0.7 rpm. |
| 申请公布号 |
WO2014129325(A1) |
申请公布日期 |
2014.08.28 |
| 申请号 |
WO2014JP52931 |
申请日期 |
2014.02.07 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
MORITA, KOSUKE;TAKAMOTO, NAOHIDE;HANAZONO, HIROYUKI;FUKUI, AKIHIRO |
| 分类号 |
H01L21/60;C09J7/00;C09J11/04;C09J133/00;C09J161/10;C09J163/00;C09J201/00;C09K3/10;H01L21/301;H01L21/304;H01L23/29;H01L23/31 |
主分类号 |
H01L21/60 |
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