| 发明名称 |
CHIP STACK WITH ELECTRICALLY INSULATING WALLS |
| 摘要 |
A method of forming a chip stack is provided and includes arraying solder pads along a plane of a major surface of a substrate forming walls of electrically insulating material between adjacent ones of the solder pads. |
| 申请公布号 |
US2014206143(A1) |
申请公布日期 |
2014.07.24 |
| 申请号 |
US201313968125 |
申请日期 |
2013.08.15 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Colgan Evan G.;Nah Jae-Woong |
| 分类号 |
H01L23/00;H01L25/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming a chip stack, comprising:
arraying solder pads along a plane of a major surface of a substrate, the solder pads each having an outer surface disposed outwardly from a conductor and above insulators and an inner surface recessed from the outer surface and disposed in contact with the conductor; and forming walls of electrically insulating material between adjacent ones of the solder pads. |
| 地址 |
Armonk NY US |
