发明名称 METHOD, APPARATUS AND SAMPLE FOR EVALUATING BONDED STRENGTH
摘要 A method for evaluating bonding strength, according to the present invention, includes a step for setting a micro-zone including a bonding boundary on a sample for evaluation; a step for forming a first groove having a predetermined depth around the micro-zone; a step for forming a second groove connected to the bonding boundary by processing the sides of the micro-zone; and a step for measuring a critical point where detachment of the micro-zone occurs by pressurizing the micro-zone.
申请公布号 KR20140081358(A) 申请公布日期 2014.07.01
申请号 KR20120151013 申请日期 2012.12.21
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, GYU SEOK;CHUNG, HEE SUK;LEE, HYUN JUNG;HAM, SUK JIN;NAM, JU WAN;CHA, JIN UK;KIM, MI YANG
分类号 G01N19/04;G01N1/28 主分类号 G01N19/04
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