METHOD, APPARATUS AND SAMPLE FOR EVALUATING BONDED STRENGTH
摘要
A method for evaluating bonding strength, according to the present invention, includes a step for setting a micro-zone including a bonding boundary on a sample for evaluation; a step for forming a first groove having a predetermined depth around the micro-zone; a step for forming a second groove connected to the bonding boundary by processing the sides of the micro-zone; and a step for measuring a critical point where detachment of the micro-zone occurs by pressurizing the micro-zone.
申请公布号
KR20140081358(A)
申请公布日期
2014.07.01
申请号
KR20120151013
申请日期
2012.12.21
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
KIM, GYU SEOK;CHUNG, HEE SUK;LEE, HYUN JUNG;HAM, SUK JIN;NAM, JU WAN;CHA, JIN UK;KIM, MI YANG