| 摘要 |
PROBLEM TO BE SOLVED: To provide an Sn alloy plating apparatus easily managing plating liquid and inexpensively replenishing an Sn component to plating liquid of Sn alloy by a convenient method. SOLUTION: The Sn alloy plating apparatus applies a power between a substrate S to be processed and an electrode 14 while allowing the substrate S to be processed to contact with the plating liquid of Sn alloy stored in a plating tank 1 to thereby form a plating film of Sn alloy. The Sn alloy plating apparatus includes: a tank 23 in which the plating liquid to be circulated between the plating tank 1 and the tank 23 is stored; a plating liquid supply means 4 which supplies the plating liquid in the tank 23 to the plating tank 1 while force-feeding the plating liquid by a pump 25; and a replenishing means 6 which is disposed at a position downstream from the pump 25 of the plating liquid supply means 4 and supplies powder of stannous oxide into the circulated plating liquid. COPYRIGHT: (C)2010,JPO&INPIT |
