| 摘要 |
A chemically amplified positive photoresist composition is provided to prevent particles or foreign materials from being re-adsorbed on a substrate by using an organic solvent in a photolithography process, thereby forming the profile without development defects. A chemically amplified positive photoresist composition comprises (A) a resin which is inherent insoluble or sparingly soluble in alkali water solution, and however, is soluble to the alkali water solution after the functional group unstable to an acid is dissociated by the action of acid, (B) a photoacid generator, (C) a solvent consisting of a first organic solvent and a second organic solvent having different specific gravities and boiling points. |
