| 摘要 |
Disclosed are a semiconductor package capable of improving productivity and reliability and a method for fabricating the same. According to the present invention, the semiconductor package includes: a first PCB having first connection pads and second connection pads on the top surface thereof; a terminal module which includes an insulating support frame, having an opening part formed in the center and holes, and conductive connection terminals, installed in the holes to protrude from the upper and the lower surface of the insulating support frame, and is mounted on the first PCB to electrically connect a part of the conductive connection terminals protruding from the lower surface of the insulating support frame to the second connection pads; a first semiconductor chip electrically connected to the first PCB through the first connection pads and mounted on the first PCB through the opening part of the terminal module; at least one second semiconductor chip; and an upper semiconductor package electrically connected to a part of the conductive connection terminals protruding from the upper surface of the insulating support frame. |
