| 发明名称 |
Method of encapsulating an electronic arrangement |
| 摘要 |
The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated. |
| 申请公布号 |
US8557084(B2) |
申请公布日期 |
2013.10.15 |
| 申请号 |
US20100766645 |
申请日期 |
2010.04.23 |
| 申请人 |
KEITE-TELGENBUESCHER KLAUS;ELLINGER JAN;KRAWINKEL THORTSTEN;STEEN ALEXANDER;TESA SE |
发明人 |
KEITE-TELGENBUESCHER KLAUS;ELLINGER JAN;KRAWINKEL THORTSTEN;STEEN ALEXANDER |
| 分类号 |
B32B37/12;B05D5/00 |
主分类号 |
B32B37/12 |
| 代理机构 |
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