SUBSTRATE PROCESSING APPARATUS AND METHOD

摘要

PROBLEM TO BE SOLVED: To provide a processing apparatus which unfailingly performs etching processing on a surface of a semiconductor wafer with an etchant.SOLUTION: A substrate processing apparatus includes: a first nozzle body 25 supplying an etchant E to a plate surface of a semiconductor wafer W; a thickness detection sensor 29 detecting a thickness of the semiconductor wafer etched with the etchant; a control device interrupting the etching with the etchant when abnormality is detected in the thickness of the semiconductor wafer which is detected by the thickness detection sensor; and a polishing body 27 processing the plate surface of the semiconductor wafer into a roughened surface when the etching with the etchant is interrupted.