发明名称 |
Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus |
摘要 |
A semiconductor apparatus adhesive composition having excellent adhesion properties when pressure-bonded and has excellent connection reliability and insulation reliability when hardened and an adhesive sheet using this adhesive composition. An adhesive composition including: (A) a silicone resin constituted of a repeating unit represented by the following general formula (1); (B) a thermosetting resin; and (C) a compound having a flux activity, where R1 to R4 represent univalent hydrocarbon groups having carbon numbers from 1 to 8, which are equal to or different from each other; each of l and m is an integer from 1 to 100; each of a, b, c, and d is 0 or a positive number and meets 0<(c+d)/(a+b+c+d)@1.0; and each of X and Y is a bivalent organic group.
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申请公布号 |
US8501879(B2) |
申请公布日期 |
2013.08.06 |
申请号 |
US201113221547 |
申请日期 |
2011.08.30 |
申请人 |
KONDO KAZUNORI;SUGO MICHIHIRO;KATO HIDETO;SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
KONDO KAZUNORI;SUGO MICHIHIRO;KATO HIDETO |
分类号 |
C08G83/00;C08F299/08;C08G77/20;C08L83/14 |
主分类号 |
C08G83/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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