发明名称 SELF-ALIGNED CONTACTS FOR HIGH k/METAL GATE PROCESS FLOW
摘要 A semiconductor structure is provided that includes a semiconductor substrate having a plurality of gate stacks located thereon. Each gate stack includes a high k gate dielectric layer, a work function metal layer and a conductive metal. A spacer is located on sidewalls of each gate stack and a self-aligned dielectric liner is present on an upper surface of each spacer. A bottom surface of each self-aligned dielectric liner is present on an upper surface of a semiconductor metal alloy. A contact metal is located between neighboring gate stacks and is separated from each gate stack by the self-aligned dielectric liner. The structure also includes another contact metal having a portion that is located on and in direct contact with an upper surface of the contact metal and another portion that is located on and in direct contact with the conductive metal of one of the gate stacks.
申请公布号 US2013189834(A1) 申请公布日期 2013.07.25
申请号 US201313791520 申请日期 2013.03.08
申请人 MACHINES CORPORATION INTERNATIONAL BUSINESS;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 RAMACHANDRAN RAVIKUMAR;DIVAKARUNI RAMACHANDRA;LI YING
分类号 H01L29/40 主分类号 H01L29/40
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