| 摘要 |
<p>A dynamic mounting system couples a first object to a second object by the attachment of a threaded member to a threaded receiving member on the second object to a predetermined depth to cause a biased compression member to exert a predetermined clamping force holding the first object to the second. The first object may be a heat sink in communication with a heat-generating component such as a processor mounted on the second object such as a circuit board. The predetermined depth is reached by advancing the threaded member until its threads pass beyond threads on the receiving member. The predetermined depth of threaded member biases the compression member to maintain a clamping force between the first and second objects within a desired range of temperature.</p> |
