| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which achieves high electric insulation reliability between conductor patterns which are exposed from a solder resist layer and located close to each other.SOLUTION: The wiring board includes: an insulation substrate 1; a first conductor pattern 6a and a second conductor pattern 6b which are formed on a surface of the insulation substrate 1 so as to be located close to each other; a solder resist layer 3 which is deposited on the surface of the insulation substrate 1 and has openings 3b exposing the first conductor pattern 6a and the second conductor pattern 6b, the solder resist layer 3 where an opening edge of each opening 3b is formed traversing between the first conductor pattern 6a and the second conductor pattern 6b; and an electroless plating metal layer deposited on surfaces of the first conductor pattern 6a and the second conductor pattern 6b which are exposed from the openings 3b. The opening edge has bending parts A, each of which bends so as to form a V shape toward the outer side or the inner side of the opening 3b between the first conductor pattern 6a and the second conductor pattern 6b. |
