首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Safety device
摘要
申请公布号
US2871106(A)
申请公布日期
1959.01.27
申请号
US19560612198
申请日期
1956.09.26
申请人
GULF RESEARCH & DEVELOPMENT COMPANY
发明人
CROWLEY EDGAR I.;FRANKE NORMAN W.;JR. THOMAS P. JOYCE,
分类号
B01J3/00
主分类号
B01J3/00
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Recessed Transistors Containing Ferroelectric Material
PARTIAL SACRIFICIAL DUMMY GATE WITH CMOS DEVICE WITH HIGH-K METAL GATE
SEMICONDUCTOR COMPOSITE FILM WITH HETEROJUNCTION AND MANUFACTURING METHOD THEREOF
NANOTUBE SEMICONDUCTOR DEVICES
EMBEDDED METAL-INSULATOR-METAL CAPACITOR
IMAGE SENSOR WITH DEEP WELL STRUCTURE AND FABRICATION METHOD THEREOF
3D HIGH RESOLUTION X-RAY SENSOR WITH INTEGRATED SCINTILLATOR GRID
INFRARED IMAGE SENSOR
SEMICONDUCTOR DEVICES WITH SIDEWALL SPACERS OF EQUAL THICKNESS
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
INTEGRATED ELECTROSTATIC DISCHARGE (ESD) CLAMPING
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEADS FOR STACKED DIE PACKAGES, AND ASSOCIATED SYSTEMS AND METHODS
MULTI-CHIP PACKAGE, TEST SYSTEM AND METHOD OF OPERATING THE SAME
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDER BUMP METALLIZATION AND METHOD OF MANUFACTURE THEREOF
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
SYSTEM ON CHIP
SEMICONDUCTOR PACKAGE AND CIRCUIT SUBSTRATE FOR THE SEMICONDUCTOR PACKAGE
UNDERFILL MATERIAL INCLUDING BLOCK COPOLYMER TO TUNE COEFFICIENT OF THERMAL EXPANSION AND TENSILE MODULUS
3D NAND STAIRCASE CD CONTROL BY USING INTERFEROMETRIC ENDPOINT DETECTION
SEMICONDUCTOR STRUCTURE INCLUDING A THROUGH ELECTRODE, AND METHOD FOR FORMING THE SAME