MANUFACTURING METHOD OF PACKAGE FOR SEMICONDUCTOR, PACKAGE FOR SEMICONDUCTOR AND SEMICONDUCTOR LIGHT-EMITTING APPARATUS

摘要

PURPOSE: A method for manufacturing a semiconductor package, the semiconductor package, and a semiconductor light emitting device are provided to effectively emit the light emitted from a semiconductor. CONSTITUTION: A semiconductor package (10) accommodates a semiconductor device (20). The semiconductor package includes a port part (11), an electrode part (12), and a filling resin (13). The port part has a mounting surface (11a) for a semiconductor device. Two port protrusion parts (111) are formed in the port part. The electrode part has a contact surface (12a) electrically connected to the semiconductor device. One electrode protrusion part (121) in the electrode part is protruded towards the port part.