| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an organic semiconductor element sealing body which improves the film formation property and the adhesion to a transparent film of a hygroscopic material and suppresses the hygroscopicity of an adhesive material adhering the hygroscopic material thereby improving the sealability of moisture and improving the durability in a sealing structure that eliminates the moisture entering into the sealing structure. <P>SOLUTION: In an organic semiconductor element sealing body 10, an organic semiconductor element 12 is sealed by film like sealing materials 14, 16. Further, a transparent hygroscopic layer 24 containing a metal oxide having the hygroscopicity is provided on an inner surface of a transparent film 16a used for at least part of the sealing materials 14, 16 through a transparent intermediate layer 22 containing a metal oxide and a fluorine containing resin which is obtained from a mixture containing a fluorine containing resin, composed of a copolymer of a monomer containing fluorine and a monomer that does not contain fluorine, and an organic metallic compound. <P>COPYRIGHT: (C)2013,JPO&INPIT |
