| 摘要 |
An in-line sputtering apparatus includes a loading chamber, a deposition chamber and an unloading chamber. The deposition chamber is positioned between the loading chamber and the unloading chamber. The deposition chamber includes at least one deposition room, a plurality of electrodes and at least one target assembly. Each deposition room defines a deposition area. A plurality of electrodes is positioned on opposite sidewalls of the deposition room, and the electrodes on the same sidewall are equidistantly spaced from each other. Each target assembly is positioned in one deposition room, which includes a plurality of targets and at least one shielding member. Each target is mounted on one electrode and away from the deposition area, a gap is formed between each two adjacent targets, each shielding member is positioned toward one gap for shielding sputtering of atoms from the edges of two neighboring targets.
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