| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a hazardous substance removal device which increases a deposition amount of a hazardous substance of the hazardous substance removal device thereby improving the removal efficiency and reducing the frequency of cleaning of the hazardous substance removal device. <P>SOLUTION: A hazardous substance removal device has a gas introduction port, which introduces a gas exhausted from a compound semiconductor thin film formation device into a cooling chamber, and a coolant pipeline, which is provided in the cooling chamber and cools the exhaust gas introduced from the introduction port, and removes a hazardous substance deposited by cooling the exhaust gas in the cooling chamber. The hazardous substance removal device has a metal mesh which is disposed around the coolant pipeline contacting with the coolant pipeline. <P>COPYRIGHT: (C)2013,JPO&INPIT |
