| 发明名称 |
Polyamide resin molding material and laminate using the same |
| 摘要 |
A polyamide resin molding material having excellent thermal weldability to thermoplastic polyurethane molded articles, which is a polyamide resin molding material including from 5 to 40 parts by mass of a specified aromatic compound (B) based on 100 parts by mass of a polyamide resin (A) having a (terminal amino group/terminal carboxyl group) molar ratio of more than 1; and a laminate using the same are disclosed. |
| 申请公布号 |
EP2581414(A1) |
申请公布日期 |
2013.04.17 |
| 申请号 |
EP20130150458 |
申请日期 |
2009.01.05 |
| 申请人 |
UBE INDUSTRIES, LTD. |
发明人 |
KUBO, TSUYOSHI;ENOMOTO, TATSUYA;YAMASAKI, KOUJI |
| 分类号 |
C08L77/00;B32B23/08;B32B23/20;B32B27/08;B32B27/18;B32B27/20;B32B27/28;B32B27/30;B32B27/32;B32B27/34;B32B27/36;B32B27/40;C08K5/10;C08K5/134;C08K5/435;C08L77/02 |
主分类号 |
C08L77/00 |
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