发明名称 |
Semiconductor device and method for manufacturing a semiconductor device |
摘要 |
A semiconductor device mountable to a substrate is provided. The device includes a semiconductor package having at least one semiconductor die, an electrically conductive attachment region, and a packaging material in which is embedded the semiconductor die and a first portion of the electrically conductive attachment region contacting the die. A metallic shell encloses the embedded semiconductor die and the first portion of the electrically conductive attachment region.
|
申请公布号 |
US8421214(B2) |
申请公布日期 |
2013.04.16 |
申请号 |
US20070973759 |
申请日期 |
2007.10.10 |
申请人 |
CHOU TA-TE;TIAN YONG-QI;LI XIAN;VISHAY GENERAL SEMICONDUCTOR LLC |
发明人 |
CHOU TA-TE;TIAN YONG-QI;LI XIAN |
分类号 |
H01L23/04 |
主分类号 |
H01L23/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|