发明名称 |
Method of manufacturing and assembling semiconductor chips with offset pads |
摘要 |
A semiconductor chip device includes a first semiconductor chip adapted to be stacked with a second semiconductor chip wherein the second semiconductor chip includes a side and first and second conductor structures projecting from the side. The first semiconductor chip includes a first edge, a first conductor pad, a first conductor pillar positioned on but laterally offset from the first conductor pad toward the first edge and that has a first lateral dimension and is adapted to couple to one of the first and second conductor structures, a second conductor pad positioned nearer the first edge than the first conductor pad, and a second conductor pillar positioned on but laterally offset from the second conductor pad and that has a second lateral dimension larger than the first lateral dimension and is adapted to couple to the other of the first and second conductor structures.
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申请公布号 |
US8394672(B2) |
申请公布日期 |
2013.03.12 |
申请号 |
US20100856632 |
申请日期 |
2010.08.14 |
申请人 |
SU MICHAEL Z.;REFAI-AHMED GAMAL;BLACK BRYAN;ADVANCED MICRO DEVICES, INC.;ATI TECHNOLOGIES ULC |
发明人 |
SU MICHAEL Z.;REFAI-AHMED GAMAL;BLACK BRYAN |
分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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