MANUFACTURING METHOD OF THROUGH WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a through wiring board which electrically connects electrodes of devices mounted on both surfaces of the through wiring board with a high degree of freedom even if the layout of the electrodes is various and the device is small and in high density.

SOLUTION: A through wiring board includes: a substrate having a first surface and a second surface; multiple through wirings formed by filling or depositing a conductive material in through holes which penetrates a space between the first surface and the second surface. A manufacturing method of the through wiring board includes the steps of: (A) radiating laser light from the first surface side of the substrate to modify multiple through hole formation regions; and (B) removing the modified through hole formation regions to form through holes.

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