| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing composition which can be used suitably for polishing an object to be polished having a hydrophobic silicon-containing portion composed of polysilicon, for example, and a hydrophilic silicon-containing portion composed of silicon oxide or silicon nitride, for example. <P>SOLUTION: The polishing composition contains a water-soluble polymer having a hydrophilic group, and abrasive grains. The water contact angle of the hydrophobic silicon-containing portion after polished using the polishing composition is smaller than the water contact angle of the hydrophobic silicon-containing portion after polished using other composition having the composition obtained by removing the water-soluble polymer from the polishing composition, and preferably becomes 57 degree or less. The examples of the water-soluble polymer include polysaccharides and alcohol compounds. <P>COPYRIGHT: (C)2013,JPO&INPIT |
