发明名称 METHOD FOR LASER DEPOSITION OF COPPER ONTO DIELECTRIC SURFACE
摘要 FIELD: electricity.SUBSTANCE: electrolyte solution is prepared, a substrate is washed, laser is focused onto the border of substrate-electrolyte, and radiation is scanned on the above surface, at the same time the electrolyte solution contains 0.02 M CuCl, 0.2 M NaOH, 0.15M sorbitol and as ligand - 0.022 M of Trilon B, which is then evaporated at the temperature of 60-80 degrees to a gel-like condition and applied onto the dielectric surface, the laser radiation capacity is selected as 500-600 mW, and speed of its displacement relative to the focus point - as 1-2.5 mcm/s.EFFECT: improved properties of a deposited copper structure during continuous scanning with a laser beam.3 dwg
申请公布号 RU2474095(C1) 申请公布日期 2013.01.27
申请号 RU20110141913 申请日期 2011.10.11
申请人 MENCHIKOV LEONID GENNAD'EVICH 发明人 KOCHEMIROVSKIJ VLADIMIR ALEKSEEVICH;LOGUNOV LEV SERGEEVICH;MENCHIKOV LEONID GENNAD'EVICH;SAFONOV SERGEJ VLADIMIROVICH;STUKALOV ALEKSANDR JUR'EVICH;TUMKIN IL'JA IGOREVICH
分类号 H05K3/00 主分类号 H05K3/00
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