| 摘要 |
Abstract Ag-Au-Pd Ternary Alloy Bonding Wire[Objects] To improve the bonding reliability of a bonding wire upon an aluminum pads which are used in circumstances of high temperature and high humidity.[Means to solve] An Ag-Au-Pd ternary alloy bonding wire for semiconductor devices made from 4 - 10 mass % of gold having a purity of 99.999 mass % or higher, 2 - 5 mass % of palladium having a purity of 99.99 mass % or higher, and remaining mass % of silver (Ag) having a purity of 99.999 mass % or higher; and this wire contains 15 - 70 mass ppm of oxidizing non-noble metallic elements, and is thermally annealed before being continuously drawn through dies , and is thermally tempered after being continuously drawn through said dies, and this wire is useful for ball bonding in a nitrogen atmosphere; Ag2A1 and a Pd rich layer produced in the interface between the Ag-Au-Pd ternary alloy wire and an aluminum pad suppress the corrosion development between the AgAl intermetallic compound layer and the wire. Fig. 1 |
