| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an automatic-laying wiring device allowing reduction in working man-hours and reduction in the size of a lay-out area by virtue of automatic design of a semiconductor device having plural power-supply voltages. <P>SOLUTION: A processing part extracts (step 16) plural wiring paths interconnecting plural cells from a result of an automatic layout, the wiring paths connecting from cells within a first power domain to those within a second power domain. The processing part performs the steps of: extracting (17) power source-active information for each operation mode of the first and second power domains; extracting (18) a third power domain being active when the first and second power domains are active; inserting (19) an additional cell into the third power domain for resolving nonconformity to a specification item of a specific cell; and wiring (22) between the specific cell within the first power domain and the specific cell within the second power domain cell via the additional cell. <P>COPYRIGHT: (C)2013,JPO&INPIT |
