| 摘要 |
<p>Provided is a lead wire connection device which connects a plurality of semiconductor cells (1a to 1n) in a row with lead wires (2a to 2n) wherein the semiconductor cells are formed, in parallel, with a plurality of finger electrodes (112) in a predetermined direction and at a predetermined interval on one of the surfaces functioning as a light receiving surface, and are provided with conductive metal films (114) on the two ends of the other surface of the semiconductor cells in a direction which intersects the plurality of finger electrodes and in a manner so as to leave exposing sections. One end of the lead wire is connected, via an adhesive conductive tape (3), to one surface of one of the neighboring semiconductor cells constituting a pair in a direction that intersections the plurality of finger electrodes, and the other end of the lead wire is connected, via an adhesive conductive tape, to a position corresponding to the removal section (115), which is formed by removing the abovementioned conductive metal film formed on both ends of the other surface, on the other surface of the other semiconductor cell.</p> |
