摘要 |
FIELD: physics. ^ SUBSTANCE: in a cooling device, having a housing made from heat-conducting material, compartments filled with heat-absorbing material which changes physical state when heated, made in form of hollow cylinders lying coaxially along the longitudinal axis of the housing, separated from each other by fins which expand towards the cooled surface, lying along the inner side surfaces of the compartments, and a cavity for accommodating the object, which is formed between the inner side surfaces of the compartments. On the outer side surface of the housing there is an additional compartment filled with heat-absorbing material which changes physical state when heated, whose phase transition temperature is lower than that of the material filling said compartments. In the second version, on the inner side surface of the housing there is an additional compartment filled with heat-absorbing material which changes physical state when heated, whose phase transition temperature is lower than that of the material filling said compartments, the cavity for accommodating the object lies inside the cylinder of the additional compartment, and the fins expand towards the additional compartment. In the third version, on the inner side surface of at least one compartment there is an additional compartment in form of a hollow cylinder filled with heat-absorbing material which changes physical state when heated, whose phase transition temperature is lower than that of the material filling said compartment, and the cavity for accommodating the object lies inside the cylinder of the additional compartment. In the fourth version, on the outer side surface of at least one compartment there is an additional compartment in form of a hollow cylinder filled with heat-absorbing material which changes physical state when heated, whose phase transition temperature is lower than that of the material filling said compartment, and the cavity for accommodating the object lies inside the cylinder of the additional compartment. ^ EFFECT: high cooling efficiency and wider field of use of the device. ^ 4 cl, 4 dwg |