| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting epoxy resin composition giving a cured material keeping reflection performance, heat resistance and light stability over a long period and having excellent mechanical strength, a reflection member comprising the cured material of the composition and an optical semiconductor device having the reflection member. <P>SOLUTION: The thermosetting epoxy resin composition contains (A) the combination of (A-1) a triazine derivative epoxy resin and (A-2) an acid anhydride or a prepolymer obtained by the reaction of them, wherein the combination or the prepolymer has the ratio by mol of [epoxy group present in (A-1) component]/[acid anhydride present in (A-2) component] of 0.6-2.0, (B) a glass fiber, (C) an internal releasing agent, (D) a reflection improving agent, (E) an inorganic filler and (F) a curing catalyst by a prescribed amount, wherein the (B) component has 50-400 μm average length and 5.0-25 μm average diameter. The optical semiconductor device has the reflection member comprising the cured material of the composition and the reflection member and an optical semiconductor element comprising the cured material of the composition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
