| 摘要 |
<p>The purpose of the present invention is to provide a method for producing multilayer substrates that exhibit excellent adhesion between metal layers having been formed, have extremely fine patterns, provide high reliability in connections between the metal layers via holes, and are excellent in yield. This method for producing a multilayer substrate involves: a base-material pretreatment step in which a hole forming step and a metal adhesion step are performed in no particular order, the hole forming step being a step of subjecting a core base material having at least an insulating layer and a first metal layer to a hole opening process and thereby forming, in the insulating layer, a hole that reaches the first metal layer from the other surface of the insulating layer, the metal adhesion step being a step in which a predetermined metal or metal ion is made to adhere to the other surface of the insulating layer; a desmearing step of performing desmearing by plasma etching after the base-material pretreatment step; a cleaning step of cleaning the core base material by using an acidic solution after the desmearing step; and a plating step of applying a plating catalyst or a precursor thereof onto the insulating layer and performing plating, and thereby forming, on the insulating layer, a second metal layer that is in conduction with the first metal layer via the hole.</p> |
