| 摘要 |
PURPOSE: A loading module for a probe card needle is provided to improve productivity by simultaneously performing a manufacturing process for a plurality of circuit boards. CONSTITUTION: Six chips electrically contacting a wafer pad are loaded on a multilayer circuit block(210). Coupling circuit substrates(221-226) connect an electric signal coming from a tester to the multilayer circuit block. The multilayer circuit block includes a needle loading circuit board(211) and a transfer circuit board(212). The transfer circuit board transfers the electric signal coming from the coupling circuit substrate to the needle mount circuit board. A branch circuit pattern is formed on the transfer circuit board.
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