发明名称 SUBSTRATE WITH THOUGH ELECTRODE AND METHOD FOR PRODUCING SAME
摘要 <p>This method for producing a substrate with a though electrode comprises: a step wherein a recessed portion (21) or a through hole (21B) is formed in one of a silicon substrate (51) and a glass substrate (54); a step wherein a projected portion (52) is formed on the other substrate; a step wherein the silicon substrate (51) and the glass substrate (54) are combined together so that the projected portion (52) is inserted into the recessed portion (21) or the through hole (21B); and a step wherein the silicon substrate (51) and the glass substrate (54) are bonded with each other.</p>
申请公布号 WO2012102252(A1) 申请公布日期 2012.08.02
申请号 WO2012JP51391 申请日期 2012.01.24
申请人 PANASONIC CORPORATION;HOZUMI, JUNICHI;TAURA, TAKUMI;OKUMURA, SHIN;NAKATANI, TOMOHIRO;TOMOIDA, RYO 发明人 HOZUMI, JUNICHI;TAURA, TAKUMI;OKUMURA, SHIN;NAKATANI, TOMOHIRO;TOMOIDA, RYO
分类号 H01L23/02;C03C27/02;G01P15/08;G01P15/125;H01L23/04;H01L23/06;H01L23/14;H01L29/84 主分类号 H01L23/02
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