发明名称 COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a component mounting device and a component mounting method capable of preventing waste. <P>SOLUTION: A component mounting device 10 comprises a pick-up head 12 for performing a pick-up step to pick up electronic components 1, a bonding head 13 for performing a delivering step and a component mounting step in connection with the pick-up head 12, and a voice coil motor 80 for driving a spindle 84 of the bonding head 13 upward and downward. In an inspection performed after the component mounting step is executed at an arbitrary number of times, a driving current value when the voice coil motor 80 drives the spindle 84 upward and downward is measured. When the driving current value in a predefined zone after starting measurement exceeds a predetermined threshold TH1, it is stored and that zone is set as a non-detection zone. The driving current value detected in the zone set as the non-detection zone is set not to be applied for judging execution of a jointing action in the component mounting step. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012104636(A) 申请公布日期 2012.05.31
申请号 JP20100251604 申请日期 2010.11.10
申请人 PANASONIC CORP 发明人 UCHIDA MAMORU
分类号 H05K13/04;H01L21/60 主分类号 H05K13/04
代理机构 代理人
主权项
地址