| 摘要 |
A resin composition for encapsulation, which contains 100 parts by weight of a synthetic resin, 10 to 500 parts by weight of a carbon precursor having a volume resistivity of 102 to 1010 Omega·cm, 0 to 60 parts by weight of a conductive filler having a volume resistivity lower than 102 Omega·cm and 100 to 1,500 parts by weight of an other inorganic filler. |
