发明名称 |
Load lock chamber, substrate processing system and method for venting |
摘要 |
A lock chamber for a substrate processing system is provided which includes at least a first conduit adapted to provide an inner portion of the lock chamber in fluid communication with atmospheric pressure or overpressure. Additionally, the lock chamber includes at least a first control valve for controlling a flow rate of the fluid communication of the inner portion of the chamber with the atmospheric pressure or the overpressure, wherein the control valve is adapted to continuously control the flow rate. Furthermore, an according method, a computer program and a computer readable medium adapted for performing the method is provided. |
申请公布号 |
EP2444993(A1) |
申请公布日期 |
2012.04.25 |
申请号 |
EP20100188415 |
申请日期 |
2010.10.21 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
GEBELE, THOMAS;LEIPNITZ, THOMAS;BUSCHBECK, WOLFGANG;BANGERT, STEFAN;LINDENBERG, RALPH |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|